Semiconductor equipment is necessary for the production of chips. Due to the complex chip manufacturing process and a wide variety of chip materials, the semiconductor equipment required is also different. Most people know that lithography machines make chips, but there are far more devices to make chips.
With the efforts of Chinese scientists, the breakthrough of domestic semiconductor equipment has been realized again. What is the technological breakthrough of semiconductor equipment this time? What is the significance of achieving a breakthrough?
Good news of ice breaking from domestic semiconductor equipment
The complexity of chip manufacturing is far beyond ordinary people's imagination. Some people only know that the lithography machine will be used for chip manufacturing. People with more knowledge also know that the lithography machine is used for chip lithography, and the extreme ultraviolet EUV lithography machine with 13.4nm wavelength will be used for the production of high-end chips.
But for the whole chip manufacturing industry, although the lithography machine is very important, it only belongs to the tip of the iceberg of the production line. The other equipment used will include ion implantation machine, cleaning machine, etching machine, developing machine and so on.
Corresponding equipment and machines will be used in different production links. It can be said that each is indispensable.
However, with the R & D and exploration of semiconductor material technology, it has entered the third generation of semiconductor materials and realized its application.
The familiar silicon belongs to the first generation of semiconductor materials. The second generation of semiconductor materials include gallium arsenide and indium phosphide. In the era of the third generation of semiconductor materials, gallium nitride and silicon carbide stand out. The third generation semiconductor materials generally have the characteristics of high thermal conductivity and stable chemical properties. They are often used in power semiconductors, such as chargers.
Through these different generations of semiconductor materials to produce chips, the semiconductor devices used are also different. The production of the first generation silicon-based chips must use front-end lithography machines, such as ARF, DUV, EUV and other types of lithography machines.
Chinese scientists have achieved a breakthrough in domestic semiconductor equipment among the third generation semiconductor materials. The silicon carbide laser stripping equipment known as the "third generation semiconductor lithography machine" has been successfully conquered, and the good news of ice breaking has also come from domestic semiconductors.
In terms of details, cetc-2 has made key technological breakthroughs. Relevant teams have realized laser stripping of small-size silicon carbide single crystals and developed laser vertical stripping equipment.
The advantages of this equipment are very obvious. Laser stripping can reduce the loss caused by traditional processes and improve the material utilization of the third generation semiconductor material silicon carbide. While reducing material loss, it also greatly strengthens the speed and efficiency of the production process, providing advantageous conditions for the preparation of silicon carbide chip products by domestic production lines.
As it is used for the stripping and cutting of third-generation semiconductor materials, the domestic breakthrough laser stripping equipment is also regarded as the "third-generation lithography machine".
In terms of importance, it is no less than the traditional lithography machine. Of course, in practice, the advanced process level must be different from DUV and EUV lithography machines, but for domestic semiconductors, every progress is commendable.
What is the significance of realizing the breakthrough of silicon carbide laser stripping equipment?
Foreign countries have mastered the first generation of semiconductor materials, while China has obvious advantages in the field of third generation semiconductor materials. Many related semiconductor enterprises have focused on the third-generation semiconductor material track such as gallium nitride, silicon carbide and catalpa oxide, realizing one technological breakthrough after another and tackling key projects. Taking the ice breaking of cetc-2 as an example, the breakthrough is of key significance.
First, let the domestic laser stripping equipment accumulate more localization experience, and let the domestic core usher in the dawn.
Before realizing the breakthrough of autonomy, many domestic equipment are technical products from abroad. If cooperation and exchanges are maintained continuously, it doesn't matter much that foreign technology is used, and it can promote the progress of both sides.
However, the changes in the chip market are obvious to all, and the importance of mastering independent technology does not need to be overemphasized. The breakthrough of silicon carbide laser stripping equipment realized by cetc-2 can accumulate more domestic experience, reduce the dependence on foreign technology in the independent technology system, and usher in the dawn of domestic cores.
Secondly, it provides production advantages for the third generation semiconductor material industry.
Many domestic industrial giants are developing innovative operations based on the third generation semiconductor materials, which can be widely used in the construction of new energy vehicles, tracks and base stations.
Throughout the application changes of three generations of semiconductor materials, they can play an important role in different fields and scenarios. Through the continuous development of scientists and researchers, there is basically a clear development direction, so the next thing to do is how to realize the popularization of production.
With the corresponding breakthrough of semiconductor equipment, it can undoubtedly provide production advantages to the third generation semiconductor material industry.
To sum up, it is of great significance to overcome the domestic laser stripping equipment. It can play a key role in helping the localization system accumulate independent knowledge and experience, or helping domestic semiconductors produce third-generation semiconductor material chips.
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